Effect Of Squeegee Blade On Solder Paste Print Quality Effect Of Squeegee Blade On Solder Paste Print Quality The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount
-free", "no clean" alternative to solder, these high
SMTAI 2010 Professional Development and Industry Progress at SMTA International Electronics Exhibition 2010 reported by: Derek LaBorie The emerging theme from the recent SMTA International Electronics Exhibition 2010
SMTnet Express, July 2, 2020, Subscribers: 28,589, Companies: 11,034, Users: 25,930 A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS Credits: Cookson Electronics Head-in-Pillow (HIP) defects are a growing concern
in the electronic interconnect industry, including attendee
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