1028 solder paste shelf life room temperature results

3D IC Development Needs Innovative Socket Solution

Voiding Control for QFN Assembly

E Newsletter SMT Express

Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability

SMT Express, Volume 2, Issue No. 6 - from SMTnet.com

Implementation challenges for PCB tracking using RFID

Implementation challenges for PCB tracking using RFID

SMTnet Express - September 24, 2020

PCB Dynamic Coplanarity At Elevated Temperatures

PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation

SMTnet Express - April 7, 2022

SMTnet Express, April 7, 2022, Subscribers: 25,732, Companies: 11,564, Users: 27,174 Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components Voids affect the thermal characteristics and mechanical properties of a