investigates the scooping effect during solder paste print
SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints
SMTnet Express, November 21, 2018, Subscribers: 31,479, Companies: 11,087, Users: 25,424 Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance Brook Sandy-Smith, Indium
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