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Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

SMTnet Express - April 15, 2021

SMT Express, Volume 2, Issue No. 5 - from SMTnet.com

Featured Article Return to Front Page Soldering Technolo

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

Stencil Design using Regression

Quantitative Evaluation of New SMT Stencil Materials

Hermetically Sealed SMD Tantalum Capacitors

SMTnet Express - August 8, 2019

SMTnet Express, August 8, 2019, Subscribers: 32,214, Companies: 10,853, Users: 25,321 Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat Credits: Alpha Assembly Solutions The requirement

A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation, Collaboration, and Cloud Computing

SMT Express, Volume 3, Issue No. 8 - from SMTnet.com