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SMTnet Express, Octomer 29, 2020, Subscribers: 28,069, Companies: 11,166, Users: 26,207 Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process Credits: Sanmina-SCI For companies
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A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
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