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SMTnet Express - October 5, 2017

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SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PART INSPECTION BEFORE OPERATIONS Always inspect part

Defect Free QFN Assembly

Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder

A Review of Test Methods and Classifications for Halogen-Free Soldering Materials

Using Flexible Circuits as an Electronic Interconnection... Do's and Don'ts

SMTnet Express - May 7, 2015

HALT Testing of Backward Soldered BGAs on a Military Product

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