SMT Express, Volume 5, Issue No. 7 - from SMTnet.com Aligning the design and supply chains Component selection is often based on design and technology needs alone, with little thought given to downstream supply chain/manufacturing concerns
SMTnet Express, May 16, 2019, Subscribers: 31,918, Companies: 10,765, Users: 26,116 Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle Credits: Cisco Systems, Inc. As the demand for higher routing density and transfer speed
