704 stencil thickness results

SMT Express, Issue No. 5 - from SMTnet.com

SMTnet Express - October 16, 2014

SMTnet Express, October 16, 2014, Subscribers: 23409, Members: Companies: 14079, Users: 36964 Oxide Thickness and Solderability Methodology to Determine Long Term Storage of BGAs and QFPs. Rama Hegde, senior member of technical staff; Freescale

A High Performance and Cost Effective Molded Array Package Substrate

SMTnet Express - March 13, 2014

SMTnet Express, March 13, 2014, Subscribers: 22531, Members: Companies: 13818, Users: 35857 Stencil Design Guidelines for Electronics Assembly Technologies Oliver Krammer; Budapest University of Technology and Economics. A student competition

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com

Gold Wire Bonding Performance and Reliability of ENEPIG Surface Finishes

Wafer-Level Packaged MEMS Switch With TSV

SMTnet Express September 19 - 2013, Subscribers: 26298

SMTnet Express - August 7, 2014

Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications