SMTnet Express, October 16, 2014, Subscribers: 23409, Members: Companies: 14079, Users: 36964 Oxide Thickness and Solderability Methodology to Determine Long Term Storage of BGAs and QFPs. Rama Hegde, senior member of technical staff; Freescale
BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
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