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Express Newsletter: substance public seminar halogen reach (Page 2 of 71)

Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure

SMTnet Express May 16 - 2013, Subscribers: 26118

Implementing Lead Free Soldering – European Consortium Research

Fuel Cell Production Revs Up

Fuel Cell Production Revs Up

Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections.

SMTAI 2010

Design and Construction Affects on PWB Reliability

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

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