SMTnet Express, September 27, 2018, Subscribers: 31,354, Companies: 11,055, Users: 25,237 Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction Carlos Tafoya, Gustavo Ramirez, Timothy O'Neill; AIM Solder Bottom
SMTnet Express, July 25, 2019, Subscribers: 32,181, Companies: 10,840, Users: 24,976 Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies Credits: Indium
SMT Placement for ICs, Connectors and Odd Shaped Components SMT Placement for ICs, Connectors and Odd-Shaped Components Accurate component placement is a basic requirement for any pick and place machine. The first step towards accurate placement
A New Stenciling Method for Reworking SMT Components A New Stenciling Method for Reworking SMT Components When reworking more complex SMT components such as finer pitch SMT components, SMTconnectors and even area array devices, the most common
Cleanliness of Stencils and Cleaned Misprinted Circuit Boards Cleanliness of Stencils and Cleaned Misprinted Circuit Boards There are long-established standards and test methods for ionic cleanliness levels for bare printed circuit boards
requirements, requires tighter tolerances on the power suppl
