962 summit bga rework machine results

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

SMTnet Express - January 15, 2014

SMTnet Express, January 15, 2014, Subscribers: 26472, Members: Companies: 13551, Users: 35633 Advanced Rework Technology and Processes for Next Generation Large Area Arrays, 01005, PoP and QFN Devices by Brian Czaplicki; Air-Vac Engineering BGA

Aiming for High First-pass Yields in a Lead-free Environment

SMTnet Express - December 16, 2021

SMTnet Express, December 16, 2021, Subscribers: 26,148, Companies: 11,476, Users: 26,983 Assembly and Rework of Lead Free Package on Package Technology Miniaturization continues to be a driving force in both integrated circuit

SMTnet Express - January 4, 2018

SMTnet Express - December 28, 2017

SMTnet Express - November 19, 2017

SMTnet Express - November 2, 2017

SMTnet Express - November 2, 2017

Are Separate Solder Flip-Chip Bonders Still Required?