Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Achieving SMT Compatible Flip Chip Assembly
Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
Improvement of Organic Packaging Thermal Cycle Performance Measurement Featured Article Improvement of Organic Packaging Thermal Cycle Performance Measurement Endicott Interconnect Technologies Glenn O. Dearing, Paul J. Hart Flip Chip Plastic
