181 techniques steven results

Method for Automated Nondestructive Analysis of Flip Chip Underfill

Method for Automated Nondestructive Analysis of Flip Chip Underfill

SMTnet Express - June 26, 2014

SMTnet Express, June 26, 2014, Subscribers: 22868, Members: Companies: 13912, Users: 36398 Enhancing Mechanical Shock Performance Using Edgebond Technology Steven Perng, Tae-Kyu Lee, and Cherif Guirguis; Cisco Systems , Edward S. Ibe; Zymet

Advanced Solder Paste Dispensing

Advanced Solder Paste Dispensing

Broadband Printing – A Paradigm

Broadband Printing – A Paradigm

Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure

SMT Express, Volume 3, Issue No. 11 - from SMTnet.com

Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies

Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies SMTnet Express May 3, 2012, Subscribers: 25098, Members: Companies: 8863, Users: 33057 Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies