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SMTnet Express, February 7, 2019, Subscribers: 31,653, Companies: 10,704, Users: 25,698 High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project Credits: Oracle Corporation The High Density Packaging (HDP
SMTnet Express, July 26, 2018, Subscribers:31,208, Companies: 11,001, Users: 24,976 Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly Jun Balangue; Keysight Technologies This paper
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
Overcoming Logistic, Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments SMTnet Express November 28, 2012, Subscribers: 26024, Members: Companies: 9054, Users: 34001 Overcoming
SMTnet Express, May 20, 2021, Subscribers: 27,111, Companies: 11,359, Users: 26,657 Rapid Deployment of Automated Test-System for High-Volume Automotive USB-C Hub Adoption and integration of USB-C chargers and hubs in automotive
SMTnet Express, December 17, 2015, Subscribers: 23,898, Members: Companies: 14,823, Users: 39,585 Good Product Quality Comes From Good Design for Test Strategies Adrian Cheong; Agilent Technologies, Inc. Product quality can be improved through
