Express Newsletter: thermally conductive tape (Page 3 of 47)

Conductive adhesives increase microchip packaging density

Conductive adhesives increase microchip packaging density Conductive Adhesives Increase Microchip Packaging Density Interconnecting microelectromechanical systems directly to printed circuit boards can improve reliability and reduce costs

SMTnet Express - July 17, 2014

SMTnet Express, July 17, 2014, Subscribers: 22938, Members: Companies: 13943, Users: 36480 Enhancing Thermal Performance in Embedded Computing for Ruggedized Military and Avionics Applications. Darren Campo, Jens Weyant, Bryan Muzyka; Advanced


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