1034 through hole diameter for wave soldering results

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SMT Express, Volume 3, Issue No. 9 - from SMTnet.com

SMTnet Express - August 10, 2017

SMTnet Express, August 10, 2017, Subscribers: 30,696, Companies: 10,656, Users: 23,635 High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing Printer-hosted processes for solder ball placement

SMT Express, Issue No. 1 - from SMTnet.com

Laser Direct Imaging of tracks on PCB covered with laser photoresist

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

SMT Express, Issue No. 5 - from SMTnet.com

SMT Express, Volume 3, Issue No. 2 - from SMTnet.com

Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications