979 tin/lead solder results

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

SMTnet Express - January 8, 2015

SMTnet Express, January 8, 2015, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies Richard

Production Line Dynamics: What Count Is What Actually Comes Out Of Your Line

SMTnet Express - June 7, 2018

SMT Express, Issue No. 2 - from SMTnet.com

Modelling of Thermal Stresses in Printed Circuit Boards

Lead-Free Rework Process For Chip Scale Packages

SMTnet Express - Octomer 29, 2020

SMTnet Express, Octomer 29, 2020, Subscribers: 28,069, Companies: 11,166, Users: 26,207 Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process Credits: Sanmina-SCI For companies

Micro-Sectioning of PCBs for Failure Analysis

Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

Leaded and Lead-Free Solder Paste Evaluation Screening Procedure Leaded and Lead-Free Solder Paste Evaluation Screening Procedure Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder