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Express Newsletter: trion (Page 1 of 1)

SMTnet Express - November 25, 2015

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Comparing techniques for temperature-dependent warpage measurement

Flux Collection and Self-Clean Technique in Reflow Applications

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

  1  

trion searches for Companies, Equipment, Machines, Suppliers & Information

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orbotech trion
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trion 20230
trion 2340
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trion2340
Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

High Throughput Reflow Oven
Thermal Interface Material Dispensing

Could your company use some $$$? Let Baja Bid turn your EXCESS ASSETS in to some much needed cash!
SMT feeders

Training online, at your facility, or at one of our worldwide training centers"


High Precision Fluid Dispensers
Thermal Interface Material Dispensing

World's Best Reflow Oven Customizable for Unique Applications
Fully Automatic BGA Rework Station

Your flex PCB design ready to validate? Let our experts take your design to the next level: outstanding DFM+Fast prototyping.
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