E Newsletter SMT Express The featured article for our Express Newsletter for the week of January 28, 2010, "The Universal PCB Design Grid System" was written by Tom Hausherr, EDA Library Product Manager, Valor Computerized Systems
, University of Greenwich This paper explores t
Laboratory, State University of New York Electromigration
SMTnet Express, October 17, 2013, Subscribers: 26325, Members: Companies: 13458, Users: 35281 Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging by L.C. Tsao; National Pingtung University of Science
SMTnet Express, October 24, 2013, Subscribers: 26339, Members: Companies: 13466, Users: 35314 Effect of Reflow Profile on Intermetallic Compound Formation by I. Siti Rabiatull Aisha, A. Ourdjini, M. A. Azmah Hanim, O. Saliza; Universiti Teknologi
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