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Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies

and Low IO Flip Chip Assemblies Universal Instruments C

Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills

With No-Flow Fluxing Underfills Universal Instrumen

How to Profile a PCB

How to Profile a PCB

SMTnet Express - October 23, 2014

SMTnet Express - April 2, 2015

A HDMI design guide for successful high-speed PCB design

A Compliant and Creep Resistant SAC-Al(Ni) Alloy

A HDMI design guide for successful high-speed PCB design

A Compliant and Creep Resistant SAC-Al(Ni) Alloy

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Lewis and Clark, Inc. is the #1 provider of pre-owned Surface Mount and In-Circuit Test equipment.