Positive Outlook from Exhibitors at IPC Midwest 2009 Positive Outlook from Exhibitors at IPC Midwest 2009 The recent IPC Midwest Conference & Exhibition in Schaumburg, IL was a small but important showcase of companies in the SMT/PCB
E Newsletter SMT Express The featured article for our Express Newsletter for the week of January 28, 2010, "The Universal PCB Design Grid System" was written by Tom Hausherr, EDA Library Product Manager, Valor Computerized Systems
Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
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