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The Environmental Impact of Pick-and-place Machines

The Environmental Impact of Pick-and-place Machines

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Joint Shear Force Heller Industries Jianbiao Pan1,

Assembly Technology Expo September 25-28, 2006 Rosemont, IL, USA

New BGA Solder Mask Repair Technique Using Laser Cut Stencils

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SMTnet Express - October 5, 2017

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Defect Coverage for Non-Intrusive Board Tests

Defect Coverage for Non-Intrusive Board Tests Defect Coverage for Non-Intrusive Board Tests Non-intrusive board test (NBT) is an emerging test methodology that integrates several complementary embedded-instrumentation-based test technologies