Technology Co., Tsinghua University This paper studies an
SMTnet Express, January 19, 2017, Subscribers: 30,111, Companies: 15,096, Users: 41,767 Rigid-Flex PCB Right the First Time - Without Paper Dolls Benjamin Jordan; Altium The biggest problem with designing rigid-flex hybrid PCBs is making sure
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Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
Apex Apex was a rousing success! APEX whipped up a storm last month as it ripped into Sin City. Any doubt that Las Vegas was the wrong destination for an electronics manufacturing show was quickly put to rest as the show proceeded to have
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