SMTnet Express, December 21, 2017, Subscribers: 31,120, Companies: 10,825, Users: 24,210 Printing and Curing of Conductive Ink Track on Curvature Substrate using Fluid Dispensing System and Oven Rd K . Khirotdin, Nurhafizzah Hassan, Hi H. Siang
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
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