in PCB assembly has become increasingly difficul
SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either
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composition Sn40-Bi60 has been manufactured by quenching me
SMTnet Express February 28, 2013, Subscribers: 26214, Members: Companies: 13305, Users: 34373 Effect of Cooling Rate on the Intermetallic Layer in Solder Joints While it has long been known that the Cu6Sn5 intermetallic that plays a critical role
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