972 using expired flux results

SMTnet Express - June 16, 2022

Strength of Lead-free BGA Spheres in High Speed Loading

AOI-AXI Duo Improves Product Yield

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment

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SMT Express, Volume 2, Issue No. 6 - from SMTnet.com

SMT Express, Volume 2, Issue No. 6 - from SMTnet.com Volume 2, Issue No. 6 Wednesday, June 14, 2000 Featured Article Return to Front Page Process Control for Solder Flux Stacy KaliszMark OwenMVTechnology Ltd. ABSTRACT Flux used in ball grid