SMTnet Express, November 6, 2014, Subscribers: 23500, Members: Companies: 14091, Users: 37109 Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes Hugh Roberts, Sven Lamprecht, Gustavo Ramos, Christian Sebald
SMTnet Express, January 21, 2016, Subscribers: 24,035, Members: Companies: 14,931, Users: 39,786 Dispelling the Black Magic of Solder Paste Tony Lentz; FCT Assembly Solder paste has long been viewed as "black magic". This "black magic" can easily
Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures by: Ronak Varia, Xuejun Fan; Lamar University
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