517 voids on qfn thermal pad results

SMT Express, Volume 3, Issue No. 6 - from SMTnet.com

Thermal Characteristics of PCB Laminates used in High Frequency Applications

Thermal Characteristics of PCB Laminates used in High Frequency Applications SMTnet Express July 11, 2012, Subscribers: 25312, Members: Companies: 8920, Users: 33335 Thermal Characteristics of PCB Laminates used in High Frequency Applications First

SMT Express, Issue No. 5 - from SMTnet.com

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com

SMTnet Express - April 22, 2021

SMTnet Express, April 22, 2021, Subscribers: 27,222, Companies: 11,340, Users: 26,602 Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components Voids affect the thermal characteristics and mechanical properties of a solder

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMTnet Express January 24 - 2013, Subscribers: 26136

Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors

Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is To Deliver Optimum Balance between Landed Cost and Time to Market

Modeling and Control of SMT Manufacturing Lines Using Hybrid Dynamic Systems