1147 what is a the largest board that can be smt results

Bridging at Reflow, What is the Cause and Can it be Eliminated?

Bridging at Reflow, What is the Cause and Can it be Eliminated? SMTnet Express April 12, 2012, Subscribers: 25060, Members: Companies: 8851, Users: 32937 Bridging at Reflow, What is the Cause and Can it be Eliminated? by: Robert Dervaes, V

Sustaining a Robust Fine Feature Printing Process

Sustaining a Robust Fine Feature Printing Process Sustaining a Robust Fine Feature Printing Process With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology

Conformal Coating Why, What, When, and How

Conformal Coating Why, What, When, and How Conformal Coating Why, What, When, and How by: Greg Caswell; DfR Solutions Conformal coating is applied to circuit cards to provide a dielectric layer on an electronic board. This layer functions as a

SMT Express, Volume 2, Issue No. 12 - from SMTnet.com

INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 35, (#ts#)) SMT Express, Volume 2, Issue No. 12 - from SMTnet.com Volume 2, Issue No. 12 Friday, December 15, 2000 Featured

Recommendations for Installing Flash LEDs on Flex Circuits

can be twisted or bent per the application needs.

What cannot be cleaned in a stencil cleaner

What cannot be cleaned in a stencil cleaner “What cannot be cleaned in a stencil cleaner?” The stencil cleaner can be one of the most versatile tools on the manufacturing floor. It can be used to clean electronic modules in various stages

Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures

SMT Express, Issue No. 6 - from SMTnet.com

SMT Express, Issue No. 6 - from SMTnet.com Volume 1, Issue No. 6 Monday, November 22, 1999 Featured Article Return to Front Page Rework Management and Optimization Learning how to manage the amount of time and money spent on rework can increase

Method of Modeling Differential Vias

Method of Modeling Differential Vias Method of Modeling Differential Vias Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high

BGA Package Component Reliability After Long-Term Storage

for leaded packages beyond a self-imposed two-year limit. T