Malaysia Reflow soldering in a nitrogen atmospher
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
SMTnet Express, November 26, 2020, Subscribers: 27,950, Companies: 11,191, Users: 26,277 SMTnet is ... • Solution to the engineers' Search • Where engineers help engineers • Not a magazine • Publishes your content to be found
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The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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