Featured Article Return to Front Page REFLOW SOLDERING
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
of the reflow oven zone temperature settings and the spe
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
Dispelling 10 Myths About Nitrogen Reflow Dispelling 10 Myths About Nitrogen Reflow In my twenty years in the electronics manufacturing industry, I have heard a lot of claims made about the use of nitrogen in inerted soldering processes: many
