SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 3 Page 5 >> Thirdly, the actual measurement of component placement starts. During QFP analysis, for example, the rotational accuracy can
SMTnet Express, July 23, 2015, Subscribers: 23,004, Members: Companies: 14,461 , Users: 38,507 Reliability Study of Bottom Terminated Components Jennifer Nguyen, Hector Marin, David Geiger, Anwar Mohammed, Murad Kurwa; Flextronics International
SMTnet Express, July 22, 2015, Subscribers: 23,004, Members: Companies: 14,461 , Users: 38,507 Reliability Study of Bottom Terminated Components Jennifer Nguyen, Hector Marin, David Geiger, Anwar Mohammed, Murad Kurwa; Flextronics International
SMTnet Express, April 8, 2016, Subscribers: 24,185, Companies: 14,769, Users: 39,976 Streamlining PCB Assembly and Test NPI with Shared Component Libraries Julian Coates; Mentor Graphics PCB assembly designs become more complex year-on-year, yet
SMTnet Express, July 25, 2019, Subscribers: 32,181, Companies: 10,840, Users: 24,976 Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies Credits: Indium
SMTnet Express, April 30, 2020, Subscribers: 36,108, Companies: 10,995, Users: 25,780 Selective Solder Fine Pitch Components On High Thermal Mass Assembly Credits: ITW EAE The number of through-hole components on PCBs has declined significantly
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