SMTnet Express, May 29, 2014, Subscribers: 22783, Members: Companies: 13874, Users: 36243 Microspring Characterization and Flip-Chip Assembly Reliability B. Cheng, D. De Bruyker, C. Chua, K. Sahasrabuddhe, I. Shubin, J. E. Cunningham, Y. Luo, K. F
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SMTnet Express, April 14, 2016, Subscribers: 24,224, Companies: 14,786, Users: 40,027 Causes and Costs of No Fault Found Events Louis Y. Ungar; A.T.E. Solutions, Inc. A system level test, usually built-in test (BIT), determines that one or more
SMTnet Express, August 31, 2017, Subscribers: 30,770, Companies: 10,706, Users: 23,739 NSOP Reduction for QFN RFIC Packages Mumtaz Y. Bora; Peregrine Semiconductor Wire bonded packages using conventional copper leadframe have been used in industry
