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SMT Express, Volume 3, Issue No. 6 - from SMTnet.com

Reworking QFN's Newly Developed Cost Effective Approach

Building Differentiated Products Through Shorter, More Predictable Design Cycles

Building Differentiated Products Through Shorter, More Predictable Design Cycles

Aiming for High First-pass Yields in a Lead-free Environment

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

SMTnet Express - December 18, 2014

SMTnet Express, December 18, 2014, Subscribers: 23,604, Members: Companies: 14,148, Users: 37,424 Head in Pillow X-ray Inspection at Flextronics Alejandro Castellanos, Adalberto Gutierrez, Gilberto Martin... - Flextronics International

SMT Express, Volume 3, Issue No. 10 - from SMTnet.com

Leaded and Lead-Free Solder Paste Evaluation Screening Procedure