Parts & Supplies | Semiconductor & Solar
Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIPconversion) 16 pinsop: 24400 CPH (0.147 SEC/SOPconversion) (Max 80 varieties
Parts & Supplies | Assembly Accessories
Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ul
Parts & Supplies | Chipshooters / Chip Mounters
Product name: YG200 YAMAHA medium speedchip mounter Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIPconversion) 16 pinsop:
Parts & Supplies | Semiconductor & Solar
JUKI JX-100LED SMT machine parameters High speed SMT machine JX-100LED Size of substrate Min. 50*50 ~ Max. 800*360mm The substrate positioning mode only corresponds to the contour reference mode Component height 12.0mm Component size 0201 (metr
Parts & Supplies | Semiconductor & Solar
JUKI KE - 2080 parameters Substrate size M-type substrate (330×250mm) L-shaped substrate (410×360mm) L-wide substrate (510 x 360mm) (optional) E-type substrate (510×460mm) Mount component height 12mm / 20mm / 25
Parts & Supplies | Pick and Place/Feeders
Fühlerlehre 0,05mm, Band 5m
Parts & Supplies | Pick and Place/Feeders
Samsung SM411 parameter The theoretical speed of the patch is 42,000 cph. Mounting Range 0402 Chip to Max □14mmIC Mounting accuracy plus or minus 0.05mm PCB size 510 (l) x 460 (w) Equipment dimensions 1,650 (l) x 1,690 (d) x 1,535 (h) Maximum
Parts & Supplies | Pick and Place/Feeders
Samsung SM411 parameter The theoretical speed of the patch is 42,000 cph. Mounting Range 0402 Chip to Max □14mmIC Mounting accuracy plus or minus 0.05mm PCB size 510 (l) x 460 (w) Equipment dimensions 1,650 (l) x 1,690 (d) x 1,535 (h) Maximum
Parts & Supplies | Assembly Accessories
Substrate size Standard Specification 50 x 50-1,200 x 360 mm Corresponding Long Size Substrate*1 50 x 50-1,500 x 360 mm Component height 6 mm official banquet/12 mm official banquet Element size 0603-33.5mm Component Recognition Dev
Parts & Supplies | Pick and Place/Feeders
Base size Min.5.0 mm × 50mm ~ Max. 1200 mm x 360mm * 1 Component height 12.0 mm * 2 Component size 0201(metric 0603) ~ 33.5 mm Component Recognition Device Laser Recognition(LNC 60) Component mount speed best condition 0.187 seconds/chip(19,300
