Parts & Supplies: print gap (Page 1 of 1)

Bicheng CSP printed circuits

Bicheng CSP printed circuits

Parts & Supplies | Circuit Board Assembly Products

1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm,6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish

Bicheng Enterprise Company

Bicheng High CTI printed circuits

Bicheng High CTI printed circuits

Parts & Supplies | Circuit Board Assembly Products

1) 160*100mm, FR-4 CTI ≥ 600V 2) 8 layer impedance control 3) Copper weight(finished inner/outer): 1 oz 4) LPI Green mask/white silk 5) Min hole 0.19mm, 5/3 track/gap 6) 1.6mm +/-10% thick 7) Immersiong gold over nickel

Bicheng Enterprise Company

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High Throughput Reflow Oven
Void Free Reflow Soldering

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pressure curing ovens

World's Best Reflow Oven Customizable for Unique Applications
Fully Automatic BGA Rework Station

Reflow Soldering Oven & Pressure Curing Oven Manufacturer in India