Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Tg170, Lead-free, Low Z-axis CTE, Low water absorption. 2). Excellent thermal stability and anti-CAF performance 3). 2-30 layer, 1.6mm thick 4). 1 oz copper finished 5). 10% impedance control 6). Immersion gold, HASL LF. 7). Suitable for hig
Parts & Supplies | Circuit Board Assembly Products
1). FR-4, Tg 170, 1 oz copper finished 2). 4 layers, 2.5mm thick 3). Min.track/space: 4/4 mil 4). Min. hole size: 0.25mm 5). 50 ohm, 100+/-10% ohm differentail /single impedance control 6). Immersion gold
Parts & Supplies | Circuit Board Assembly Products
1). 100*85mm, FR-4 Tg170/ Polyimide 2). 4 layer count rigid/2 layer flex 3). 1.0mm thick rigid/0.15mm thick flex 4). 1 oz each layer 5). Green LPI solder mask/white ident 6). Immersion gold
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Tg 170 + Rogers 4350B 2). 290*130mm/1up 3). 6 layers at 1.6mm thick 4). Green solder mask/White ident 5). 35um copper finished, ED copper. 6). Electroless gold. 7). Countersunk slots.
Parts & Supplies | Circuit Board Assembly Products
1) 190*130mm/10up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting holes
Parts & Supplies | Circuit Board Assembly Products
1). 177 x 75mm (2UP), FR-4 Tg 170 2). 1.6mm +/-10%, 6 layer 3). Min. hole 0.15mm, 4/4 track/gap 4). Finished copper weight inner/outer 1 oz 5). Green solder mask/ White ident 6). Immerstion gold. 7). Fine and micro BGA
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