Career Center | Waterbury, Connecticut USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
Polymers/Plastics - Industrial/Electronic, Coatings/Adhesives - Production/R&D
Career Center | Hong Kong, Hong Kong | Engineering,Production,Research and Development
Area of expertise:- Conductive adhesive packaging esp Anisotropic conductive Ahesives, Flexible substrates,Lead free soldering.
Career Center | , | Engineering,Management,Production,Sales/Marketing
Over 26 years experience in SMT manufacturing process, equipment, materials, production efficiency, quality. Solder Paste and Adhesive printing and deposition. Process and Training needs assessment. Sales and Engineering support for equipment, materi
Career Center | Leominster, Afghanistan | Engineering
3+ years of experience in SMT, through-hole and mixed technology, including screen printing and stencil design, adhesive dispensing, device placement and insertion, reflow and wave profiling, manual assembly, and AOI. Experience in DFM review. Stro
Career Center | Suzhou, Jiangsu China | Purchasing,Sales/Marketing
Good English communication, and good Chinese communication, I can source all items in China, but I were working for my former company as a sales in various kinds of adhesive tapes, such as Kapton tape, Powder coating tape, Teflon Tape, and so on, so
Career Center | Mount Prospect, Illinois USA | Engineering,Human Resources,Management,Production,Quality Control,Research and Development,Sales/Marketing
New Product Development Continuous Improvement Quality Improvement Process Improvement / Development Specialty in Process Control for screen print, pick & place, reflow, wave solder, adhesive dispense, rework and repair. Experienced in
Career Center | , Portugal | Engineering,Maintenance,Production,Quality Control,Technical Support
SMT Process engineer Quality Efficiency Continuous improvement 11 years of experience in high volume production in a Japanese corporation Expertise in: Solder paste printing (DEK, Panasonic) Adhesive dispensing (FUJI, Panasonic) Components Pick and p
Career Center | Rochester, New York USA | Engineering,Production,Sales/Marketing,Technical Support
Working Experience: Fairchild Semiconductor, South Portland, ME Package Simulation Co-op: Technology CAD Group (Mar.2002-Present) Thermal simulation for 40 lead fine pitch QSOP & 48 lead one die fine pitch QSOP: Created a 3D model
Career Center | Osasco, Sao Paulo Brazil | Sales/Marketing
Sales Skills: �X Sales of Equipments for Electronic Printed Circuit board Assembly �X Customer needs analisis �X Equipments quotation preparation �X Presentations and demonstrations preparation for customers �X Fairs and seminars participation �
Career Center | Greenville, New Hampshire USA | 2001-04-09 20:08:51.0
I have been in manufacturing for over 7 years here and in January was given the role of New Products Engineer, which involved creating PCB programs to the machines, ie. (Siemens pick and place, MPM screen printers, and Camalot adhesive machine), I al
