Career Center - Resumes: au solderability (Page 1 of 1)

Board Assembly and Packaging Specialist

Career Center | Flower Mound, Texas USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support

 SMT and THT Soldering Process Optimization  Working knowledge of MPM Screen Printers, Fuji and Siemens Placement Equipment, BTU, ERSA and Vitronics Reflow Ovens, Camalot 3500 Underfill Dispense Machine, SEHO and Electrovert Wave Soldering Systems

Materials/Metallurgical Engineer

Career Center | , | Engineering,Production,Quality Control,Research and Development

WORK EXPERIENCE Hutchinson Technology Incorporated, MN Feb.2006-Present Process Development Engineering Co-op �Study of voids generation in solder ball bonded Cu substrate with Ni/Au metallization. �Diffusion & Intermetallic growth study in sold

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