Career Center - Resumes: black solder ball (Page 1 of 2)

SMT Engineer

Career Center | Bangalore, Karnataka India | Engineering,Production,Research and Development,Technical Support

� Exposure to Siemens Pick & Place M/Cs. � Basic knowledge in POP components, 01005 component package. � Exposure in SIX SIGMA TOOLS � WHITE BELT. � Performing DFM for the new products & running products. � Exposure in scre

Microelectronic Assembly Technician

Career Center | Littleton, CO USA | Production

Possess 18 years relevant work experience in manual/Auto bonding on Micro-Electronic & RF to support new product development in R&D Lab in defense & commercial sectors.  Have an advanced soldering skill in both Through-Hole/SMT, and J-STD-001 cert

Timothycsmall

Career Center | washington dc, North Carolina USA | Production

Primary function - A Fuji/Panasonic Operator working in Fuji/Panasonic SufaceMountTechnologies (SMT) placing capacitors, resistors, flat pack, etc. on a Fuji/Panasonic MV machine. Troubleshoot when card gets solder balls, bridging, and pin through h

SMT Technician

Career Center | Tao-Yuan Hsien, taiwan Taiwan | Production

TECHNICAL SKILLS Operating Systems � Installation and configuration of various operating systems including Microsoft Windows 9x, ME, 2000, 2003, XP Professional, DOS Applications � Computer literate, knowledge on Windows based applications, Profici

EMS-PCBA/PCA Process/Quality (Six sigma Black belt)

Career Center | Mysore, Tirane India | Engineering,Production,Quality Control,Technical Support

· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc

Materials/Metallurgical Engineer

Career Center | , | Engineering,Production,Quality Control,Research and Development

WORK EXPERIENCE Hutchinson Technology Incorporated, MN Feb.2006-Present Process Development Engineering Co-op �Study of voids generation in solder ball bonded Cu substrate with Ni/Au metallization. �Diffusion & Intermetallic growth study in sold

Sr. Lab Tech

Career Center | costa mesa, California USA | Engineering

� Support all training in Engineering Lab, Maintained Engineering Services Lab in Irvine, Ca, Support soldering training and Fast Track Assy. Line for Rockwell International, El Paso TX. � Assemble / re-work/modify electronic breadboards and printed

Electronic and RF Test Engineer

Career Center | Norfolk, Virginia USA | Engineering,Maintenance,Management,Production,Purchasing,Quality Control,Research and Development,Technical Support

Jay Selter Test Engineer / Technician; Formal Education: Schools and Courses completed. BROOKLYN TECHNICAL HIGH SCHOOL, NEW YORK: Electrical engineering design (two year major): Meter design and construction; Transformer design and materials; Moto

Manufacturing Engineer

Career Center | Juneau, Wisconsin USA | Engineering,Management,Production,Quality Control

DAVID A BOND N5116 Sinissippi Point Road ? Juneau, Wisconsin 53039 ? (920) 349-3094 ? E-mail: tex007@charter.net SUMMARY A professional, results-oriented Product and Process Engineer with extensive experience in manufacturing. Proven s

SMT Process Engineer

Career Center | Rochester, New York USA | Engineering,Production,Sales/Marketing,Technical Support

Working Experience: Fairchild Semiconductor, South Portland, ME Package Simulation Co-op: Technology CAD Group (Mar.2002-Present) Thermal simulation for 40 lead fine pitch QSOP & 48 lead one die fine pitch QSOP: Created a 3D model

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