11 black solder joint results

Career Center - Resumes: black solder joint (Page 1 of 2)

Microelectronic engineer

Career Center | Arlington, Texas USA | Engineering,Research and Development

Microelectronics packaging and reliability engineer with three years experience as a post doc. researcher currently conducting several industry oriented projects including: - Development of mechanical bending fatigue test for BGA solder joint evalua

EMS-PCBA/PCA Process/Quality (Six sigma Black belt)

Career Center | Mysore, Tirane India | Engineering,Production,Quality Control,Technical Support

· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc

Materials/Metallurgical Engineer

Career Center | , | Engineering,Production,Quality Control,Research and Development

WORK EXPERIENCE Hutchinson Technology Incorporated, MN Feb.2006-Present Process Development Engineering Co-op �Study of voids generation in solder ball bonded Cu substrate with Ni/Au metallization. �Diffusion & Intermetallic growth study in sold

Electronic and RF Test Engineer

Career Center | Norfolk, Virginia USA | Engineering,Maintenance,Management,Production,Purchasing,Quality Control,Research and Development,Technical Support

Jay Selter Test Engineer / Technician; Formal Education: Schools and Courses completed. BROOKLYN TECHNICAL HIGH SCHOOL, NEW YORK: Electrical engineering design (two year major): Meter design and construction; Transformer design and materials; Moto

SMT Engineer

Career Center | Puducheery, Tamil nadu India | Production

________________________________________V. KIRUBAKARAN SMT Production Engineer Mobile: +918925842383 | E-Mail: gvkirubakaran@gmail.com Passport Number: M6034648 | Issued date: 05 February 2015 | Expiry date: 05 February 2015 ___________________

SMT Process Engineer

Career Center | Rochester, New York USA | Engineering,Production,Sales/Marketing,Technical Support

Working Experience: Fairchild Semiconductor, South Portland, ME Package Simulation Co-op: Technology CAD Group (Mar.2002-Present) Thermal simulation for 40 lead fine pitch QSOP & 48 lead one die fine pitch QSOP: Created a 3D model

Maintenance,Technical engineer

Career Center | Thane, INDIA India | Maintenance,Production,Technical Support

Experience: 12 years relevant work experience in repotted electronic manufacturing industries that includes Data Communications, Consumer Electronics and PC Manufacturing Industry. Work experience in Engineering process and Quality Control. Technica