Career Center | Temecula, California USA | Engineering
Over five years of experence developing semi-conductor, industrial, and electronic packaging applications (i.e., Underfill, SMA, Encapsulation, Dam and Fill, Gasket, Flux, Conformal Coating). Provided technical and process support for automated fluid
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
Career Center | rochester, New York USA | Engineering
Skill Set . ASQ: Certified Six Sigma Green Belt (CSSGB) (Appearing 12/01/2007) . SMT Process Related Skills . Stencil Printing . Reflow Profiling . Selective Soldering . Rework . RSlogix � Programmable Logic Controller . Minitab 15.1 . Arena - Manu
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