Career Center - Resumes: multilayer bonding (Page 1 of 1)

Flip chip Packaging Engineer (Process)

Career Center | Toronto,, Ontario Canada | Engineering,Research and Development

DEBTANU BASU 40 Fountain Head Road Toronto, ON M3J2V1 (416) 514 0619 Cell: 416 258 7488 E-mail: debtanubasu@aol.com With more than six years of experience in the field of flip chip technologies seeking a challenging technical position in the field

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