Career Center | Hong Kong, Hong Kong | Engineering,Production,Research and Development
Area of expertise:- Conductive adhesive packaging esp Anisotropic conductive Ahesives, Flexible substrates,Lead free soldering.
Career Center | Waterbury, Connecticut USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
Polymers/Plastics - Industrial/Electronic, Coatings/Adhesives - Production/R&D
Career Center | Rochester, New York USA | Production,Quality Control,Research and Development,Technical Support
Experience with assembly, technical and quality issues concerning printed circuit boards and related processes. Received increasing levels of responsibility and leadership throughout career.
Career Center | NEW DELHI, NEW DELHI India | Engineering
*TESTING OF COMMUNICATION EQUIPOMENTS LIKE MODEMS,MEDIA CONVERTERS,LAN EXTENDERS,E1 WEXTENDERS,MANAGED/UNMANAGED SWITCHES,POE BASED CARDS, WITH REPARING. *HANDLING TEAM OF 4 JUNIOR ENGINEERS FOR DAILY WORK EXCIQUTION. *DAILY REPORTING TO OUR MANAG
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
Career Center | Hunsur, Karnataka India | Engineering
My resume will give you a complete picture of my strengths and skills, but some of the important skills are: Working on any type of pcb. Multilayer up to 40 layer, HDI, blind-Buried,Cu-Inlay ,Flex,Cu-Filling ,Flex-rigid board, HF-Board, CIC board,
Career Center | , Ontario Canada | Engineering,Maintenance,Management,Production,Quality Control,Research and Development,Technical Support
PROCESS / EQUIPMENT / MANUFACTURING ENGINEER. M.Sc. mech. engr. degree w/ 8+ yrs. exp. Process and dvpmt., rework, packaging, mfg. engineering, equipment engineering, NPI, wireless technologies CDMA. Analyzed and applied best practices in high-speed,
Career Center | Tempe, Arizona USA | Engineering,Production
Extensive experience in the fabrication of printed circuit boards, thick film hybrids, electroluminescent phosphor and lamps, electrolytic tilt sensors. Process control in photoimaging, etching, plating, lamination, screen printing, solder mask, etc
Career Center | , Ontario Canada | Engineering,Maintenance,Management,Production,Quality Control,Research and Development,Technical Support
� A professional with 8+ years of experience in mechanical, manufacturing, process, NPI, packaging and equipment engineering. � Experienced in Project Management, designs, and experimental solutions, R&D studies for new processes introduction in the
