Career Center - Resumes: remove bga underfill (Page 1 of 1)

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Process Engineering/Maintenance Technician

Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control

• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat

SMT Process Engineer

Career Center | Fremont, California USA | Engineering,Production

4 years of PCB assembly process.

PCBA ENGINEERING MANAGER

Career Center | , | Engineering,Production,Quality Control

SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS

Process Engineer

Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support

SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.

12 Years experience in Equipment, Manufacturing and Technical Support.

Career Center | , | Engineering,Technical Support

COMPETENCIES & SKILLS : Proficient in SMT chip Mounters and IC/Flip chip Placers like Assembleon, Panasonic, Yamaha & etc. Experienced in handling Screen Printers like Minami, Dek, Panasonic and semi-automatic Printers. Expert in Camalot

Printed Circuit Assembly Production/Process Engineer

Career Center | tulsa, Oklahoma | Engineering

Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th

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