Career Center | Hong Kong, Hong Kong | Engineering,Production,Research and Development
Area of expertise:- Conductive adhesive packaging esp Anisotropic conductive Ahesives, Flexible substrates,Lead free soldering.
Career Center | , | Engineering,Management,Production,Sales/Marketing
Over 26 years experience in SMT manufacturing process, equipment, materials, production efficiency, quality. Solder Paste and Adhesive printing and deposition. Process and Training needs assessment. Sales and Engineering support for equipment, materi
Career Center | Tempe, Arizona USA | Engineering,Production
Extensive experience in the fabrication of printed circuit boards, thick film hybrids, electroluminescent phosphor and lamps, electrolytic tilt sensors. Process control in photoimaging, etching, plating, lamination, screen printing, solder mask, etc
Career Center | Mount Prospect, Illinois USA | Engineering,Human Resources,Management,Production,Quality Control,Research and Development,Sales/Marketing
New Product Development Continuous Improvement Quality Improvement Process Improvement / Development Specialty in Process Control for screen print, pick & place, reflow, wave solder, adhesive dispense, rework and repair. Experienced in
Career Center | , Portugal | Engineering,Maintenance,Production,Quality Control,Technical Support
SMT Process engineer Quality Efficiency Continuous improvement 11 years of experience in high volume production in a Japanese corporation Expertise in: Solder paste printing (DEK, Panasonic) Adhesive dispensing (FUJI, Panasonic) Components Pick and p
Career Center | Rochester, New York USA | Engineering,Production,Sales/Marketing,Technical Support
Working Experience: Fairchild Semiconductor, South Portland, ME Package Simulation Co-op: Technology CAD Group (Mar.2002-Present) Thermal simulation for 40 lead fine pitch QSOP & 48 lead one die fine pitch QSOP: Created a 3D model
Career Center | Greenville, New Hampshire USA | 2001-04-09 20:08:51.0
I have been in manufacturing for over 7 years here and in January was given the role of New Products Engineer, which involved creating PCB programs to the machines, ie. (Siemens pick and place, MPM screen printers, and Camalot adhesive machine), I al
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
Career Center | Manila, Tirane Philippines | Engineering,Maintenance,Management,Production,Sales/Marketing,Technical Support
Position: Equipment Technician Department: Engineering/ Equipment (February 2005 � Present) DUTIES AND RESPONSIBILITIES: Repair major equipment breakdown/malfunction. Implements routine eq
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