Career Center | Arlington, Texas USA | Engineering,Research and Development
Microelectronics packaging and reliability engineer with three years experience as a post doc. researcher currently conducting several industry oriented projects including: - Development of mechanical bending fatigue test for BGA solder joint evalua
Career Center | , | Engineering,Production,Quality Control,Research and Development
WORK EXPERIENCE Hutchinson Technology Incorporated, MN Feb.2006-Present Process Development Engineering Co-op �Study of voids generation in solder ball bonded Cu substrate with Ni/Au metallization. �Diffusion & Intermetallic growth study in sold
Career Center | Puducheery, Tamil nadu India | Production
________________________________________V. KIRUBAKARAN SMT Production Engineer Mobile: +918925842383 | E-Mail: gvkirubakaran@gmail.com Passport Number: M6034648 | Issued date: 05 February 2015 | Expiry date: 05 February 2015 ___________________
Career Center | Parwanoo, Himachal Pradesh India | 2016-06-29 04:36:44.0
Engineering
Career Center | Parwanoo, Himachal Pradesh India | 2016-06-29 05:04:33.0
Production
Career Center | Thane, INDIA India | Maintenance,Production,Technical Support
Experience: 12 years relevant work experience in repotted electronic manufacturing industries that includes Data Communications, Consumer Electronics and PC Manufacturing Industry. Work experience in Engineering process and Quality Control. Technica
Career Center | Thane, INDIA India | Maintenance,Production,Technical Support
Experience: 12 years relevant work experience in repotted electronic manufacturing industries that includes Data Communications, Consumer Electronics and PC Manufacturing Industry. Work experience in Engineering process and Quality Control. Technica
Career Center | Rochester, New York USA | Engineering,Production,Sales/Marketing,Technical Support
Working Experience: Fairchild Semiconductor, South Portland, ME Package Simulation Co-op: Technology CAD Group (Mar.2002-Present) Thermal simulation for 40 lead fine pitch QSOP & 48 lead one die fine pitch QSOP: Created a 3D model
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
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