UV Laser PCB Depaneling System, Dual Table for High Volume Laser Depaneling Purpose: The processing and application objects are PCB, FPC soft and hard plate and related material cutting, cover opening and other operations. Efficient integration
ETA T Series Lead Free Reflow Oven If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Reflow Oven, Reflow Soldering, Reflow Soldering Oven, SMT
MPM UP 2000 HIE for sale,if you interested welcome to contact us soon. BOARD HANDLING Minimum/ 2" x 2" (50.0 mm x 50.0 mm) to Maximum size 20" x 16" (508 mm x 406 mm) (16" or greater board lengths require dedicated workholder) Thickness range
VP-2500HP-CL32 PNP machine using 32 CL feeder and 2x20 line push feeder plus up to 4 vibration feeder units! HIWIN linear guides on all axis, no head shaking like competitor machines using small belts and simple round rods HIWIN ball screw spindl
TI New and Original ISO7842DWWR in Stock IC SOIC-16 , 21+ package ISO7842DWWR High Isolation Rated, Quad, 2/2, Reinforced Digital Isolator LM7301IM5X/NOPB SOT23-5 TI 21+ 12000 SN74LV08APWR TSSOP14 TI 21+ 10000 OPA4313IPWR TSSOP14 TI 20+ 4
TI New and Original LM22670QMR-ADJ/NOPB in Stock IC SOP8 , 22+ package LM22670QMR-ADJ/NOPB 4.5V to 42V, 3A SIMPLE SWITCHER® Buck Converter with Frequency Synchronization LM7301IM5X/NOPB SOT23-5 TI 21+ 12000 SN74LV08APWR TSSOP14 TI 21+ 10000
Analog Devices(ADI) New and Original AD7631BSTZ in Stock IC LQFP-48 , 18+ package AD7631BSTZ 18-Bit, 250 kSPS, Differential Programmable Input PulSAR® ADC LM7301IM5X/NOPB SOT23-5 TI 21+ 12000 SN74LV08APWR TSSOP14 TI 21+ 10000 OPA4313IPWR
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