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High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
This is what the fully assembled How to Solder Kit looks like. Depress the button and one of the LEDs will remain lit at the end (it eventually times out). You can add some kind of template so each LED position has some meaning. The PCB has a real gr
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
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JUKI KE2070L High Speed Chip Shooter SMT Machine MC Model KE-2070 Board size M size (330×250mm) ○ L size (410×360mm) ○ L-Wide size(510×
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
Semi Auto SMT PCB Solder Paste Printing Machine Model 500mm 800mm 1200mm 1500mm Direction Left → Right, Right → Left Power Single phase 220V, 50/60Hz,100W Translational speed 0-2200mm/mins